SCPS311 March 2026
ADVANCE INFORMATION
| THERMAL METRIC(1) | Package | UNIT | ||
|---|---|---|---|---|
| DGS (VSSOP) | RHB (VQFN) | |||
| 32 PINS | 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 80.1 | 44.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 35.4 | 35.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 44.1 | 25.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 2.0 | 2.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 43.7 | 24.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 14.2 | °C/W |