SLUSFF6 April 2025 LMG1020-Q1
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMG1020-Q1 | UNIT | |
|---|---|---|---|
| YBV (WCSP) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 131.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| YJB | Junction-to-board characterization parameter | 37.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |