ZHCSJC6F March 2016 – June 2018 TDA2E
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Table 5-4, Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case device power consumption.