SLUSG28 August 2025 BQ25176K
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
訂購信息
7.2.1.3 Application Curves
CIN = 1μF, COUT = 1μF, VIN = 5V, VOUT = 3.8V, ICHG = 600mA (unless otherwise specified)
| RISET = 500Ω |
| VIN = 5V → 0V |
| RISET = 500Ω → 0Ω |
| RISET = 500Ω | OUT = open-circuit |
| RISET = 0.5kΩ | ISYS = 0mA → 250mA |