1 Introduction

The electronics industry is making a significant investment in surface mount technology (SMT), driven by the potential for cost savings and increased efficiency. However, current carrier tape technology has a limitation - it typically only accommodates one row of components per product, with a standard packing quantity of 500 to 3,000 units in one reel. In a mass production, this means that the reel needs to be replaced up to 10 times a day, resulting in significant productivity losses, increased warehouse space, higher transportation costs, and more industrial waste. To address this challenge, TI's new technology references the design of trays, introducing a matrix-style arrangement to tape and reel that increases packing density by 200%. In this article, TI explores how its Ecoship? technology and Enviropack? tape and reel solutions can help SMT assembly houses overcome these challenges. By leveraging this revolutionary packing solution, our customers can mount TI's packages at a lower cost and ultimately alleviate storage and shipping challenges.

Figure 1-1 Multiple Row Carrier tape, Ecoship Technology and Enviropack Tape and Reel