SBOK095 December 2024 TRF0208-SP
The TRF0208-SP is packaged in a 12-pin RPV, WQFN - Flip Chip RLF (WQFN-FCRLF, 12) package as shown in Figure 3-1. The TRF0208SP-EVM evaluation board (EVM) was used to evaluate the single-events-effects (SEE) of the TRF0208-SP. Top view of the evaluation board used for the radiation testing are shown in Figure 3-1. Schematic of the evaluation board used for radiation testing is shown in Figure 3-3. For more technical information about the TRF0208-SP, see https://www.ti.com/product/TRF0208-SP/technicaldocuments.
Figure 3-1 Decapped TRF0208-SP (Left) and Device Pin Out (Right)
Figure 3-2 TRF0208SP-EVM Board Top View (Left) and Bottom View (Right)
Figure 3-3 TRF0208-SP Evaluation
Board Schematic for SEE Testing