TPA2005D1

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關(guān)斷引腳兼容 1.8V 邏輯電平的 1.4W 單聲道、模擬輸入 D 類揚(yáng)聲器放大器

產(chǎn)品詳情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Control interface Hardware Output power (W) 1.4 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Control interface Hardware Output power (W) 1.4 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm2 3 x 4.9 VSON (DRB) 8 9 mm2 3 x 3
  • 1.4 W Into 8 ? From a 5 V Supply at THD = 10% (Typ)
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-? Speaker:
      • 84% at 400 mW
      • 79% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-μA Shutdown Current
  • Capable of Driving an 8-? Speaker (2.5 V ≤ VDD ≤ 5.5 V) and a 4-? Speaker (2.5 V ≤ VDD ≤ 4.2 V)
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Internally Generated 250-kHz Switching Frequency Eliminates Capacitor & Resistor
    • Improved PSRR (–71 dB at 217 Hz) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification & Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Space Saving Package
    • 3 mm × 3 mm QFN package (DRB)
    • 2.5 mm × 2.5 mm MicroStar Junior BGA Package (ZQY)
    • 3 mm x 5 mm MSOP PowerPAD Package (DGN)
  • Use TPA2006D1 for 1.8 V Logic Compatibility on Shutdown Pin

All trademarks are the property of their respective owners.

  • 1.4 W Into 8 ? From a 5 V Supply at THD = 10% (Typ)
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-? Speaker:
      • 84% at 400 mW
      • 79% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-μA Shutdown Current
  • Capable of Driving an 8-? Speaker (2.5 V ≤ VDD ≤ 5.5 V) and a 4-? Speaker (2.5 V ≤ VDD ≤ 4.2 V)
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Internally Generated 250-kHz Switching Frequency Eliminates Capacitor & Resistor
    • Improved PSRR (–71 dB at 217 Hz) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification & Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Space Saving Package
    • 3 mm × 3 mm QFN package (DRB)
    • 2.5 mm × 2.5 mm MicroStar Junior BGA Package (ZQY)
    • 3 mm x 5 mm MSOP PowerPAD Package (DGN)
  • Use TPA2006D1 for 1.8 V Logic Compatibility on Shutdown Pin

All trademarks are the property of their respective owners.

The TPA2005D1 is a 1.4-W high efficiency filter-free class-D audio power amplifier in a MicroStar Junior™ BGA, QFN, or MSOP package that requires only three external components.

Features like 84% efficiency, –71-dB PSRR
at 217 Hz, improved RF-rectification immunity, and
15 mm2 total PCB area make the TPA2005D1 ideal for cellular handsets. A fast start-up time of 9 ms with minimal pop makes the TPA2005D1 ideal for PDA applications.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2005D1. The device allows independent gain control by summing the signals from each function while minimizing noise to only 48 μVRMS.

The TPA2005D1 has short-circuit and thermal protection.

The TPA2005D1 is a 1.4-W high efficiency filter-free class-D audio power amplifier in a MicroStar Junior™ BGA, QFN, or MSOP package that requires only three external components.

Features like 84% efficiency, –71-dB PSRR
at 217 Hz, improved RF-rectification immunity, and
15 mm2 total PCB area make the TPA2005D1 ideal for cellular handsets. A fast start-up time of 9 ms with minimal pop makes the TPA2005D1 ideal for PDA applications.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2005D1. The device allows independent gain control by summing the signals from each function while minimizing noise to only 48 μVRMS.

The TPA2005D1 has short-circuit and thermal protection.

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頂層文檔 類型 標(biāo)題 格式選項(xiàng) 下載最新的英語版本 日期
* 數(shù)據(jù)表 TPA2005D1 1.4-W MONO Filter-Free Class-D Audio Power Amplifier 數(shù)據(jù)表 (Rev. G) PDF | HTML 2015年 10月 27日
應(yīng)用手冊 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
應(yīng)用手冊 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
應(yīng)用手冊 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日
應(yīng)用手冊 Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 2005年 10月 28日
應(yīng)用手冊 Power Rating in Audio Amplifier (Rev. A) 2005年 3月 4日
用戶指南 TPA2005D1EVM - User Guide 2002年 6月 27日

設(shè)計(jì)與開發(fā)

如需其他信息或資源，請點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁面查看（如有）。

評估板

TPA2005D1EVM — TPA2005D1 評估模塊 (EVM)

The TPA2005D1 is a 1-W high efficiency filter-free class-D audio power amplifier in a MicroStar™ BGA package that requires only three external components. It is ideal for small battery operated electronics including wireless or cellular handsets, personal digitalassistants (PDAs), and voice (...)

用戶指南: PDF
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仿真模型

TPA2005D1 PSpice Transient Model (Rev. A)

SLOM184A.ZIP (84 KB) - PSpice Model
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仿真模型

TPA2005D1 TINA-TI Transient Reference Design

SLOM186.TSC (26 KB) - TINA-TI Reference Design
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仿真模型

TPA2005D1 TINA-TI Transient Spice Model

SLOM185.ZIP (17 KB) - TINA-TI Spice Model
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模擬工具

PSPICE-FOR-TI — PSpice? for TI 設(shè)計(jì)和仿真工具

PSpice? for TI 可提供幫助評估模擬電路功能的設(shè)計(jì)和仿真環(huán)境。此功能齊全的設(shè)計(jì)和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費(fèi)使用，包括業(yè)內(nèi)超大的模型庫之一，涵蓋我們的模擬和電源產(chǎn)品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設(shè)計(jì)和仿真環(huán)境及其內(nèi)置的模型庫，您可對復(fù)雜的混合信號設(shè)計(jì)進(jìn)行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計(jì)和原型解決方案，然后再進(jìn)行布局和制造，可縮短產(chǎn)品上市時(shí)間并降低開發(fā)成本。?

在?PSpice for TI 設(shè)計(jì)和仿真工具中，您可以搜索 TI (...)
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參考設(shè)計(jì)

TIDA-010040 — 警報(bào)音發(fā)生器參考設(shè)計(jì)

此參考設(shè)計(jì)提供了一種產(chǎn)生類似于 IEC60601-1-8 醫(yī)療設(shè)備標(biāo)準(zhǔn)中所述的警報(bào)的方法。關(guān)鍵時(shí)序參數(shù)可通過固件進(jìn)行編程。所有參數(shù)（包括脈沖寬度、脈沖頻率、內(nèi)部頻率、脈沖上升時(shí)間、音量控制以及優(yōu)先級）都可以使用固件進(jìn)行控制。模擬包絡(luò)由 MSP430FR2311 和模擬電路的組合生成。
設(shè)計(jì)指南: PDF
原理圖: PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
VSON (DRB) 8 Ultra Librarian

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

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